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http://148.72.244.84:8080/xmlui/handle/xmlui/3952Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Salah N. Farhan | - |
| dc.contributor.author | Muataz H. Ismael | - |
| dc.contributor.author | Ayad Dari Jaafar | - |
| dc.date.accessioned | 2023-10-17T07:20:07Z | - |
| dc.date.available | 2023-10-17T07:20:07Z | - |
| dc.date.issued | 2018 | - |
| dc.identifier.issn | 1999-8716 | - |
| dc.identifier.uri | http://148.72.244.84:8080/xmlui/handle/xmlui/3952 | - |
| dc.description.abstract | A novel curing agent (1,4-diaminobenzene) was used to enhance behavior of the epoxy resin system. The effect of the curing agent content (12 to 21 wt%) subjected to the isothermal curing temperatures at 80 °C to 110 °C were performed. Results indicate that the gel time was effected slightly on the viscosity when the curing temperature was higher than 90 °C and curing material consist over from 18wt %. These results explain that reaction rates caused by higher curing temperature. | en_US |
| dc.language.iso | en | en_US |
| dc.publisher | University of Diyala – College of Engineering | en_US |
| dc.subject | Rheological, | en_US |
| dc.subject | Curing Agent System | en_US |
| dc.subject | Epoxy System, | en_US |
| dc.subject | Curing Temperature | en_US |
| dc.title | Rheological Behavior of Isothermal Cured Epoxy/1,4-Diaminobenzene Systems | en_US |
| dc.type | Article | en_US |
| Appears in Collections: | مجلة ديالى للعلوم الهندسية / Diyala Journal of Engineering Sciences (DJES) | |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| SALAH NURI 7.pdf | 506.22 kB | Adobe PDF | View/Open |
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