Please use this identifier to cite or link to this item:
http://148.72.244.84:8080/xmlui/handle/xmlui/3952| Title: | Rheological Behavior of Isothermal Cured Epoxy/1,4-Diaminobenzene Systems |
| Authors: | Salah N. Farhan Muataz H. Ismael Ayad Dari Jaafar |
| Keywords: | Rheological, Curing Agent System Epoxy System, Curing Temperature |
| Issue Date: | 2018 |
| Publisher: | University of Diyala – College of Engineering |
| Abstract: | A novel curing agent (1,4-diaminobenzene) was used to enhance behavior of the epoxy resin system. The effect of the curing agent content (12 to 21 wt%) subjected to the isothermal curing temperatures at 80 °C to 110 °C were performed. Results indicate that the gel time was effected slightly on the viscosity when the curing temperature was higher than 90 °C and curing material consist over from 18wt %. These results explain that reaction rates caused by higher curing temperature. |
| URI: | http://148.72.244.84:8080/xmlui/handle/xmlui/3952 |
| ISSN: | 1999-8716 |
| Appears in Collections: | مجلة ديالى للعلوم الهندسية / Diyala Journal of Engineering Sciences (DJES) |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| SALAH NURI 7.pdf | 506.22 kB | Adobe PDF | View/Open |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.